Widely used to reworking BGA in motherboard (laptop, PS3,PS4,XBOX360, Mobile phone, Network set top box etc)
Detail Parameter:
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Total Power
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4800W
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Upper Heating Power
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800W
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Lower Heating Power
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Second zone:1200W, Third zone:( IR )2700W
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Power Supply
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AC 220V±10V 50/60HZ
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Overall Dimension
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760*760*680mm
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Locating Mode
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V-shape card slot, PCB holder can be adjustable
by X and Y axes with universal jigs.
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Temperature Controlling
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K-type thermocouple closed loop control, independent temperature control, precision up to ±3 degree
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PCB Size
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Max 410*370mm, Min 20*20mm
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Thermocouple ports
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1 unit
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Weight of machine
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40KG
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Main feature:
1.Perfect support Soldering, Desoldering, Removing and Mounting the BGA Chip
2.Touch screen and PLC controlling to ensure it work stably and reliably.
3.Components mounting accuracy within 0.01mm , Repair success rate 99%
4.Rework BGA, VGA, CCGA, QFN, CSP, LGA, SMD, etc
5.Precise Temperature Control, accuracy within 3℃
6.Superior Safety Functions, with Emergency protection
7.Humanized design user-friendly operation system
8. Hot air nozzle can be rotated in 360 degree
8.Samsung, Sony,ASUS,Lenovo also use this model for their repair service
What we can supply:
We are professional BGA rework station manufacturer, commit to provide the one-stop service for customers.
So that we also supply the motherboard repair equipment(like soldering station, desoldering gun, etc) and BGA Reballing
tools(like solder ball, flux paste, solder wick, reballing kit, reballing stencils for laptop, ps3,xbox360, mobile, etc)
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Cheap Price Bga Rework hot air station WDS-4860 Three Temperature Zones manual BGA Rework Images
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